| LC control no. | sh2002010597 |
|---|---|
| Topical heading | Physical vapor deposition |
| Variant(s) | Deposition, Physical vapor PVD (Physical vapor deposition) Vapor deposition, Physical |
| See also | Vapor-plating |
| Found in | Work cat.: Sidhwa, A.J. Advantages of using PVD two-step titanium nitride barrier process ... 2002: p. 47 (physical vapor deposition, PVD; films are deposited atomically by means of fluxes of individual neutral or ionic species ... PVD techniques include all techniques based on evaporative deposition ... [or] based on sputtering) ASTI (Physical vapor deposition: PVD processes) INSPEC database, Oct. 2, 2002 (physical vapor deposition, PVD) Encyc. of physical sci. and tech., 2002: v. 7, p. 879 (Metals are deposited by several methods, the primary ones being CVD and physical vapor deposition (PVD) (i.e., evaporation and sputtering)) LC database, Oct. 2, 2002 (Physical vapor deposition, PVD) McGraw-Hill encyc. of sci. and tech.: v. 19, p. 178 (the vapor deposition processes can be classified into two basic groups, physical (evaporation and sputtering) and chemical") |
| Not found in | Web. 3; Ei Thesaurus, 1995; Int. encyc. of sci. and tech., 1999 |
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